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I have a technical question about thermal management with mid-power LED diodes like Samsung LM301H.
Do you use thermal vias on the PC board anymore? Either under the LED diode footprint or even around the footprint?
I was reading about this on a ten year old application note from Cree called "Optimizing PCB Thermal Performance for XLamp® XQ & XH Family LEDs"
Is this still a thing they do?
Do you use thermal vias on the PC board anymore? Either under the LED diode footprint or even around the footprint?
I was reading about this on a ten year old application note from Cree called "Optimizing PCB Thermal Performance for XLamp® XQ & XH Family LEDs"
Is this still a thing they do?